TechnologyMove to 'panel-level' packing on square substrate would impact entire supply chainTSMC is exploring a new type of chip packaging in response to demand for more powerful AI chips. (Photo by Shinya Sawai)TAIPEI -- Taiwan Semiconductor Manufacturing Co. is close to finalizing the specifications for a radically new approach to chip packaging to meet demand for more powerful AI chips, with plans to start small volumes of production around 2027, Nikkei Asia has learned.While chips are genera...