Why We Invested in Silicon Box and the Advanced Chiplet Packaging
With Weili Dai, Noboru Saito, Dr. Sehat Sutardja, Dr. BJ Han, Dr. Nick Sutardja (left to right) in CES 2024Henry Huang, Ph.D. — Investment Director, TDK VenturesEnvisioning a Chiplet Future for Integrated CircuitsThe year was 2015 and, as happens annually, the world’s foremost experts in integrated circuits were coming together for the always highly anticipated technical discussion and exchange of ideas at the International Solid-State Circuits Conference (ISSCC). In this renowned forum, surroun...
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