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Testing For Thermal Issues Becomes More Difficult

Increasingly complex and heterogeneous architectures, coupled with the adoption of high-performance materials, are making it much more difficult to identify and test for thermal issues in advanced packages. For a single SoC, compressing higher functionality into a smaller area concentrates the processing and makes thermal effects more predictable. But that processing can happen anywhere in an advanced package, where there may be a combination of general-purpose and highly specialized processors,...

Read more at semiengineering.com

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