Even after 27 years, IBM’s innovation in introducing Cu (copper) damascene technology for BEOL (Back-End-of-Line) in CMOS semiconductor production remains the industry standard for high-performance and low-power logic integrated circuit chip manufacturing. IBM Research has continued to innovate in the field, and published two significant BEOL related papers at the 2024 IEDM conference.The first paper is an invited paper written by IBM Fellow Daniel Edelstein. It focuses on the advancements and f...