Biden-Harris Administration Opens Funding Competition for Up to $1.6 Billion to Accelerate U.S. Semiconductor Advanced Packaging Technologies
Media Contact: Hannah Robinson, hannah.robinson [at] chips.gov (hannah[dot]robinson[at]chips[dot]gov)
Credit:
A. Kim/NIST
Today, the Biden-Harris Administration issued a Notice of Funding Opportunity (NOFO) funded by the CHIPS and Science Act to enable the United States semiconductor industry to adopt innovative new advanced packaging flows for semiconductor technologies. This investment comes as part of the President’s overarching Investing in America agenda, which is increasing American compet...
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