(Image credit: GlobalWafers) Scientists from the Institute of Computing Technology at the Chinese Academy of Sciences introduced an advanced 256-core multi-chiplet and have plans to scale the design up to 1,600-core chips that employ an entire wafer as one compute device.It is getting harder and harder to increase transistor density with every new generation of chips, so chipmakers are looking for other ways to increase performance of their processors, which includes architectural innovations, l...