Technology|U.S. Plans Up to $1.6 Billion in Funding for Packaging Computer Chipshttps://www.nytimes.com/2024/07/09/technology/chips-packaging-semiconductors.htmlU.S.WorldBusinessArtsLifestyleOpinionAudioGamesCookingWirecutterThe AthleticAdvertisementSKIP ADVERTISEMENTYou have a preview view of this article while we are checking your access. When we have confirmed access, the full article content will load.The proposed funding, part of the CHIPS Act, is intended to stoke chip packaging, a process...