Apple will reportedly use a more advanced SoIC packaging technology for its M5 chips, as part of a two-pronged strategy to meet its growing need for silicon that can power consumer Macs and enhance the performance of its data centers and future AI tools that rely on the cloud. Developed by TSMC and unveiled in 2018, SoIC (System on Integrated Chip) technology allows for the stacking of chips in a three-dimensional structure, providing better electrical performance and thermal management compared...