ArrowArtboardCreated with Sketch.ArtboardCreated with Sketch.Title ChevronTitle ChevronIcon Mail ContactPath LayerPositive ArrowSemiconductorsRectangular substrates to unlock more power are also being tested by Intel and Samsung Big semiconductor makers are exploring new methods of chip packaging to place more chipset on each piece of substrate. (Photo by Cheng Ting-Fang) June 20, 2024 13:11 JST | TaiwanHSINCHU, Taiwan -- Taiwan Semiconductor Manufacturing Co. is exploring a new method of adv...