Researchers at the IEEE Electronic Components and Technology Conference (ECTC) last week pushed the state of the art in a technology that is becoming critical to cutting-edge processors and memory. Called hybrid bonding, the technology stacks two or more chips atop each other in the same package, allowing chipmakers to increase the number of transistors in their processors and memories despite a general slowdown in the pace of the traditional transistor shrinking that once defined Moore’s Law. R...