(Image credit: TSMC) TSMC announced its leading-edge 1.6nm-class process technology at its North American Technology Symposium 2024. This new A16 manufacturing process will be the company's first Angstrom-class production node, promising to outperform its predecessor, N2P, by a significant margin. The technology's most important innovation will be its backside power delivery network (BSPDN). Just like TSMC's 2nm-class nodes (N2, N2P, and N2X), the company's 1.6nm-class fabrication process will r...