(Image credit: Samsung) This week, Samsung presented its vision for next-generation memory and storage solutions both for AI and general-purpose applications at the Future of Memory and Storage (FMS) 2026 conference. The company introduced zHBM, zNAND-O, and BV-NAND technologies at the event, and while they are aimed at very different applications, they share one common ingredient: they all rely on wafer bonding.Here's a breakdown of each type of technology that the company announced.zHBM: Samsu...