Samsung, SK Hynix test Chinese chip tools as hedge against US risks
Item 1 of 2 FILE PHOTO: Samsung Electronics HBM4, a sixth-generation high-bandwidth memory solution for AI and HPC applications, on display during the 2025 Korea Tech Festival in Seoul, South Korea, December 4, 2025. REUTERS/Kim Hong-Ji/File Photo/File Photo[1/2]FILE PHOTO: Samsung Electronics HBM4, a sixth-generation high-bandwidth memory solution for AI and HPC applications, on display during the 2025 Korea Tech Festival in Seoul, South Korea, December... Purchase Licensing Rights, opens new...
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