Illinois researchers led by Qing Cao develop low-temperature method to stack silicon circuits vertically in 3D chips, achieving 98-100% yields to extend Moore's Law beyond traditional scaling limits.

A new way to build chips: Sequentially stacking silicon to extend Moore’s law

5/26/2026 Researchers led by Qing Cao have demonstrated a scalable way to directly and sequentially stack high-performance silicon circuits. This advance marks a critical step toward realizing the full potential of three-dimensional chips that could carry computing beyond the limits of traditional scaling. Written by Michael O'Boyle Researchers led by Illinois Grainger Engineering professor Qing Cao have demonstrated a scalable way to directly and sequentially stack high-performance silicon circ...