SK Hynix Inc. is ramping up its spending on advanced chip packaging, in hopes of capturing more of the burgeoning demand for a crucial component in artificial intelligence development: high-bandwidth memory.The Icheon-based firm is investing more than $1 billion in South Korea this year to expand and improve the final steps of its chip manufacture, said Lee Kang-Wook, a former Samsung Electronics Co. engineer who now heads up packaging development at SK Hynix. Innovation with that process is at ...