JEDEC develops SPHBM4 standard with 512 pins, 4:1 serialization to boost AI GPU memory capacity via cheaper organic substrates, lower costs than 2,048-pin HBM4.

JEDEC developing reduced pin count HBM4 standard to enable higher capacity

The JEDEC Solid State Technology Association is developing a way to increase overall high bandwidth memory (HBM) capacity with longer channel distances to enable more HBM stacks per GPU. JEDEC is the Joint Electron Device Engineering Council. Standard Package High Bandwidth Memory (SPHBM4) is similar to an HBM4 device with its silicon substrate, but with fewer pins in the different base interface die design, which can be mounted on standard organic substrates. Mian Quddus Mian Quddus, chairman o...