Intel GenAI For Yield, TSMC CFET & 3D Stacking, AMD 3D Device Modeling, Applied Materials Material Innovation, SK Hynix HBM 4, Micron 3D DRAM & FeRAM, Hybrid Bonding vs TCB - IEDM 2023
Gordon Moore’s spirit lives on as the industry keeps chasing smaller, denser, cheaper, and faster semiconductor devices. The premiere place to hear about these developments is the International Electron Devices Meeting (IEDM), and today we want to do a roundup of this year’s developments for the future of semiconductor device scaling. For those who missed last year, we covered many important topics.What themes did we hear most about at IEDM this year?We’ll cover a few of the topics where AI was ...
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