(Image credit: Intel) TSMC is taking the wafer-scale fabrication battle into the third dimension with a new technology. At its North American Technology Symposium, the company introduced its next-generation system-on-wafer platform—CoW-SoW—that will enable 3D integration with wafer-scale designs. This builds on the InFO_SoW system-on-wafer integration technology technology that TSMC introduced in 2020, which lets it build wafer-scale logic processors. So far, only Tesla has adopted this tech for...